The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 30, 2004
Filed:
Aug. 12, 2002
Applicant:
Inventors:
James Knapp, Gilbert, AZ (US);
Stephen St. Germain, Scottsdale, AZ (US);
Assignee:
Semiconductor Components Industries, L.L.C., Phoenix, AZ (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 2/144 ; H01L 2/148 ; H01L 2/150 ;
U.S. Cl.
CPC ...
H01L 2/144 ; H01L 2/148 ; H01L 2/150 ;
Abstract
A method of making a semiconductor device ( ) by attaching a top surface of a first laminate ( ) to a bottom surface of a second laminate ( ) to form a leadframe ( ) and mounting a semiconductor die ( ) to the leadframe to form the semiconductor device. The first semiconductor die is encapsulated with a molding compound ( ) and material is removed from the first laminate to form a mold lock ( ) with the molding compound.