The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 30, 2004
Filed:
Dec. 31, 2002
Shigemasa Saito, Kanagawa, JP;
Fuji Electric Co., Ltd., Kawasaki, JP;
Abstract
A fire retardant multilayered printed wiring board without halogen compounds, having enhanced thermal conductivity of insulator layers to prevent electronic components from being damaged during soldering. The insulator layers are formed of a glass cloth impregnated with an epoxy resin composition. Metal foil layers, in each of which a circuit is formed, are laminated alternately with the insulator layers. The epoxy resin composition includes at least phosphate ester, aluminum hydroxide, silica, calcium oxide, strontium titanate, and iron oxide. Inorganic components are provided in the insulator layers as about 8% to about 18% by mass of P O , about 20% to about 28% by mass of Al O , about 0.1% to about 0.6% by mass of SiO , about 0.1% to about 1.0% by mass of Cl, about 15% to about 20% by mass of CaO, about 0.3% to about 0.5% by mass of TiO , about 0.2% to about 0.4% by mass of Fe O , and about 0.1% to about 0.3% by mass of SrO, in converted values as measured by an X-ray fluorescence analysis.