The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 30, 2004
Filed:
Jul. 17, 2002
Applicant:
Inventor:
Kouji Tometsuka, Tokyo, JP;
Assignee:
Hitachi Kokusai Electric Inc., Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C23C 1/600 ;
U.S. Cl.
CPC ...
C23C 1/600 ;
Abstract
A substrate processing apparatus and a method for manufacturing a semiconductor device can resolve the problems that semiconductor film by-products are incorporated into a boat rotation mechanism so as to allow the mechanism portion to be locked, whereby a high quality semiconductor film can be generated with stability for a long period of time.
Tometsuka, Kouji. (2004). Substrate processing apparatus and method for manufacturing semiconductor device (U.S. Patent No. 6712909). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6712909
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile