The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 30, 2004

Filed:

Nov. 28, 2001
Applicant:
Inventors:

Toshio Saito, Tokyo, JP;

Ikuhiko Ozeki, Kohnan, JP;

Assignee:

Fisa Corporation, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29C 4/514 ; B29C 7/072 ; H01L 2/156 ;
U.S. Cl.
CPC ...
B29C 4/514 ; B29C 7/072 ; H01L 2/156 ;
Abstract

A method for injection molding of resin or rubber at an insert positioned in a lower mold injects and fills melted resin or rubber into a cavity of an upper mold through a gate. The lower metal mold has a flexible supporting member supporting the mold insert. The supporting member is vertically movable in a recess formed on the upper surface of the lower mold. The underside thereof is supported by the tip ends of shafts of pressing members that operate independently. The movable supporting member is moved while being pressed by the respective shafts of the pressing members to the upper mold at a plurality of positions. The resin or rubber is molded when the upper surface of the insert uniformly contacts the underside of the upper mold by bending of the movable supporting member.


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