Heatsink and heatsink device using the heatsink

Abstract

A heatsink and a heatsink device using the heatsink are provided. The heatsink is formed of a plurality of thin heatsink plates, and the individual heatsink plates are bound to one another to be radially spread out, thereby enlarging the surface area of the heatsink and increasing its heat-dissipating efficiency. In the heatsink device, the heatsink is installed in an air duct, and cool air is supplied into the air duct by a fan, to thereby further increase the heat-dissipating efficiency. The binding force of the heatsink to a heat-generating source can be elastically maintained, which allows the heatsink to remain bound to the heat-generating source even after an external impact. In addition, by cutting out an upper portion of the heatsink plate, folding lines of the heatsink plate are shortened so that the heat-absorbing portions of the heatsink plates stacked upon one another can be tightly joined to form a heatsink by a reduced force. The resulting heatsink has a recession at the center of its upper surface. This structure allows cool air propelled by the fan to reach the bottom center of the heatsink, thereby further enhancing the heat-dissipating efficiency. Also, vibration and noise caused while cool air flows over the heat-dissipating portions of the heatsink are reduced.