The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 23, 2004
Filed:
Sep. 29, 1999
Naotaka Tanaka, Ibaraki-ken, JP;
Hiroyuki Ohta, Tsuchiura, JP;
Ichiro Anjoh, Koganei, JP;
Hideo Arima, Yokohama, JP;
Akio Hasebe, Higashimurayama, JP;
Kenichi Yamamoto, Kodaira, JP;
Hitachi, Ltd., Tokyo, JP;
Abstract
Electrode pads are formed on a tape circuit to correspond to positions of solder bumps on an IC. A plurality of pins formed on a periphery of the tape circuit provide electrical connection between the tape circuit and a mother socket. An elastomer sheet is provided between a portion of the tape circuit, on which the electrode pads are formed and the IC is mounted, and the mother socket, and a side surface of the sheet, which contacts with the tape circuit, is formed with cut grooves in lattice fashion such that respective centers of the electrode pads substantially coincide with intersections of the grooves. Thus portions defined by the grooves on the sheet are made independent from one another to enable accommodating pushing forces from the solder bumps, so that, even if dispersion in height generates between the solder bumps, the respective portions defined by the grooves are hardly influenced by one another, and so accommodate the pushing forces from the solder bumps to permit the solder bumps and the electrode pads to surely contact with each other.