The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 23, 2004
Filed:
Jun. 18, 2001
Applicant:
Inventors:
Assignee:
Renesas Technology Corp., Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 2/3495 ;
U.S. Cl.
CPC ...
H01L 2/3495 ;
Abstract
A semiconductor device is provided with outer leads which show themselves in the bottom surface of the resin encapsulated body. This structure eliminates minute chipping and cracking near the resin which has been cut in the vicinity of the end of the outer lead. The semiconductor device is produced in such a way that a push-back-portion is previously arranged between leads of the lead frame and the push-back-portion is pushed down after molding. The resulting semiconductor device has outer leads such that there is no encapsulating resin between outer leads which show themselves in the bottom surface of the resin encapsulated body.