The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 23, 2004
Filed:
Jun. 18, 2002
Sony Corporation, , JP;
Abstract
A conductive bond comprises conductive colloidal particles and a dispersant for dispersing the conductive colloidal particles. A multilayer printed circuit board includes a plurality of substrates, each having a conductive pattern on at least one face thereof. Any adjacent two of the substrates are separated by an insulating layer, and the conductive pattern of a first substrate of the two substrates faces the conductive pattern of a second substrate of the two substrate. The conductive pattern of a first substrate has one or more bumps for electrical connection to the second substrate. The bump and the conductive pattern of the second substrate are bonded to each other with the conductive bond applied to the tip of the bump.