The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 23, 2004

Filed:

Feb. 02, 2001
Applicant:
Inventors:

Takashi Yamaguchi, Wakayama, JP;

Katsutoshi Aoki, Wakayama, JP;

Kuniyasu Kawabe, Wakayama, JP;

Assignee:

Kao Corporation, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08L 6/706 ; C08F 2/034 ; C08J 5/18 ;
U.S. Cl.
CPC ...
C08L 6/706 ; C08F 2/034 ; C08J 5/18 ;
Abstract

A molding composition comprising an aggregate [Component (A)], a linear unsaturated polyester [Component (B)] and/or linear unsaturated polyester polyamide [Component (C)], and a radical generator [Component [D]), characterized in that each of Component (B) and Component (C) comprises a specific alkylene oxide adduct of bisphenol A in an amount of from 3 to 50 mol % based on the total amount of constituent monomers of each of Component (B) and Component (C) and a molded article obtained by molding the composition.


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Yamaguchi, Takashi. (2004). Molding composition (U.S. Patent No. 6710106). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6710106

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