The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 23, 2004
Filed:
Dec. 17, 1999
Applicant:
Inventor:
Tatsuya Sakamoto, Kyoto, JP;
Assignee:
Rohm Co., Ltd, Kyoto, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 2/14763 ;
U.S. Cl.
CPC ...
H01L 2/14763 ;
Abstract
A method for disposing metal wiring on the surface of an insulating film formed on a semiconductor substrate. A recess is formed in the insulating film, and a metal wiring film composed of a metal wiring material is laminated on the insulating film having the recess formed therein. Further, the metal wiring film laminated on a surface area outside the recess in the insulating film is selectively removed. Thereafter, the metal wiring film laminated above the recess is polished by chemical mechanical polishing.
Sakamoto, Tatsuya. (2004). Method of fabricating semiconductor device (U.S. Patent No. 6709973). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6709973
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile