The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 23, 2004
Filed:
Oct. 21, 2002
Holger Hübner, Baldham, DE;
Infineon Technologies AG, Munich, DE;
Abstract
In the three-dimensional integration of integrated circuits, a thinned semiconductor substrate is arranged on a second semiconductor substrate and is mechanically and electrically connected thereto. To that end, in the second, thinned semiconductor substrate, continuous contact holes are formed proceeding from a substrate rear side as far as a first metal wiring plane on a substrate front side. In order to align the contact holes with the structures arranged on the front side, a structure is arranged on the front side of the substrate, which can be used as an alignment mark on the front side. The structure is overgrown with a useful layer and uncovered proceeding from the rear side of the substrate, so that the structure can also be used as an alignment mark from the rear side. This avoids an alignment error between the structures arranged on the front side and the rear side.