The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 23, 2004

Filed:

Oct. 17, 2002
Applicant:
Inventors:

Mamoru Arikawa, Saitama, JP;

Shigeru Kanehara, Saitama, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B23Q 1/700 ; G01M 1/900 ;
U.S. Cl.
CPC ...
B23Q 1/700 ; G01M 1/900 ;
Abstract

A free-state diameter, upon cutting each metal ring, is set so that when the ratio of a continuously variable transmission is a value in a TOP state and a metal ring receives a severe load, a corrected amplitude of a stress on an outer peripheral surface of the metal ring calculated from an amplitude and a middle value of the stress on the outer peripheral surface of the metal ring is equal to a corrected amplitude of a stress on an inner peripheral surface of the metal ring calculated from an amplitude and a middle value of the stress on the inner peripheral surface of the metal ring. Therefore, an appropriate free-state diameter is set in consideration of a stress based on a tensile load of the metal ring and a stress based on the bending load of the metal ring.


Find Patent Forward Citations

Arikawa, Mamoru. (2004). Method for setting free-state diameter of metal ring (U.S. Patent No. 6708383). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6708383

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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