The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 16, 2004

Filed:

Feb. 07, 2002
Applicant:
Inventors:

Shinya Watanabe, Tokyo, JP;

Hiroyuki Katou, Tokyo, JP;

Assignee:

NEC Corporation, Tokyo, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 2/3544 ;
U.S. Cl.
CPC ...
H01L 2/3544 ;
Abstract

On a wafer, patterns of arrayed waveguide gratings are formed. Each arrayed waveguide grating has an arcuate shape obtained by arranging two curved-line portions convexed in the same direction at a predetermined spacing and connecting respective end portions thereof with two mutually parallel straight lines. These arrayed waveguide gratings are cut out along straight cutting paths and curved cutting paths in which two arcuate portions of the same shape are arranged side by side in a lateral direction. Thus, a larger number of chips can be produced as compared with a case where each array waveguide grating is cut out in a rectangular shape. Ultrasonic machining techniques or sandblast machining techniques are suitable for the cutting operation.


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