The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 16, 2004
Filed:
Mar. 03, 2000
Applicant:
Inventor:
Wataru Kakinoki, Yokohama, JP;
Assignee:
Murata Manufacturing Co., Ltd., Kyoto-fu, JP;
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B32B 7/02 ; H05K 1/14 ; H05K 7/20 ; H05K 1/00 ;
U.S. Cl.
CPC ...
B32B 7/02 ; H05K 1/14 ; H05K 7/20 ; H05K 1/00 ;
Abstract
Two types of bonding layers having different chemical components and different chemical and/or physical properties are alternately formed in a bonding layer forming region. An exemplary combination of the two types of bonding layers includes a bonding layer which is resistant to high-temperature environments and another bonding layer which is resistant to impacts. A product having such a bonding surface structure is resistant to both high-temperature environments and impacts and has a highly stable bonding structure.
Quick Actions:
Kakinoki, Wataru. (2004). Bonding surface structure and bonding structure therewith (U.S. Patent No. 6706378). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6706378
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile