The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 16, 2004
Filed:
Oct. 11, 2002
Applicant:
Inventors:
Nori Yoshihara, Ohtsu, JP;
Akira Taniguchi, Ohtsu, JP;
Assignee:
Toyo Boseki Kabushiki Kaisha, Osaka, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B32B 3/100 ;
U.S. Cl.
CPC ...
B32B 3/100 ;
Abstract
A resin composition for high-frequency bonding with a dielectric loss tangent of 0.03 or higher at a frequency of 40 MHz, containing a thermoplastic resin having a melting point of 80° C. to 200° C. in an amount of 70% to 99% by volume, based on the total volume of the composition, and a conductive material having a volume resistivity of 10 &OHgr;.cm or lower in an amount of 30% to 1% by volume, based on the total volume of the composition.
Yoshihara, Nori. (2004). Resin composition for high-frequency bonding (U.S. Patent No. 6706136). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6706136
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile