The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 16, 2004
Filed:
Jun. 21, 2001
Applicant:
Inventors:
Tomohisa Motomura, Fuchu, JP;
Yoshitaka Fukuoka, Hachioji, JP;
Assignee:
Kabushiki Kaisha Toshiba, Kawasaki, JP;
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 3/36 ;
U.S. Cl.
CPC ...
H05K 3/36 ;
Abstract
A manufacturing method of a printed wiring board. On a conductor plate approximately conical conductor bumps . . . are formed, the conductor bumps . . . being caused to penetrate through a prepreg to project tip ends of the conductor bumps . . . from an opposite side of the prepreg The tip ends of the conductor bumps . . . and interconnection patterns and on surfaces of core material A, before bonding, are exposed to plasma to activate. The activated tip ends of the conductor bump . . . and interconnection patterns and on the surface of the core material are stacked to bond both.