The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 09, 2004

Filed:

Dec. 30, 1999
Applicant:
Inventors:

Eric Yuen-Jun Chan, Mercer Island, WA (US);

Quynhgiao Nguyen Le, Bellevue, WA (US);

Yuing Huang, Seattle, WA (US);

Assignee:

The Boeing Company, Seattle, WA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H04B 1/000 ;
U.S. Cl.
CPC ...
H04B 1/000 ;
Abstract

More cost-effective fiber optic interface modules, such as fiber optic transmitter modules and fiber optic receiver modules, are provided that meet the high performance requirements demanded by avionics and other specialized applications over a wide range of temperatures and other environmental conditions. The fiber optic interface module includes a printed wiring board having a pair of outwardly extending arms that define a notch therebetween. The fiber optic interface module also includes an integrated circuit mounted upon a medial portion of the printed wiring board and an optical subassembly. The optical subassembly includes a receptacle and an optoelectronic device, such as a light source or a detector. The receptacle generally defines an internal cavity for receiving the optoelectronic device and a pair of slots proximate the internal cavity. As such, the transmitter optical subassembly can be mounted to the printed wiring board so as to be at least partially disposed in the notch defined by the printed wiring board. In this regard, the respective arm portions of the printed wiring board are preferably inserted into the pair of slots defined by the receptacle in order to permit a portion of the optical subassembly to be disposed within the notch. As such, the path length between the optoelectronic device and the integrated circuit is effectively reduced, thereby correspondingly reducing circuit parasitics and improving the performance of the fiber optic interface module. Additionally, a method of fabricating a fiber optic interface module is provided.


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