The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 09, 2004
Filed:
Sep. 11, 2002
Victor Company of Japan, Ltd., Yokohama, JP;
Abstract
A manufacturing method of a printed circuit board is composed of a first process of forming a pattern of lower electrode at a specific portion on a substrate in which a capacitor element is formed, a second process of forming a capacitor insulative layer that is constituted by a paste material having high permittivity selectively at a position that corresponds to the lower electrode , a third process of forming an interlayer insulative film having low permittivity all over the entire surface of the substrate including the capacitor insulative layer , a fourth process of exposing the capacitor insulative layer by grinding the surface of the interlayer insulative film so as to be flat, and a fifth process of forming a capacitor element by forming a pattern of upper electrode on the surface of the capacitor insulative layer . Accordingly, the printed circuit board is excellent in mechanical strength, low in manufacturing cost and high in reliability and capacitance accuracy.