The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 6703261 B1

PDF
Full Text
Expired
Date of Patent:
Mar. 09, 2004

Filed:

Jan. 28, 2003
Applicant:
Inventor:

Mamoru Ito, Tamamura, JP;

Assignee:

Hitachi, Ltd., Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 2/144 ; H01L 2/148 ; H01L 2/150 ;
U.S. Cl.
CPC ...
H01L 2/144 ; H01L 2/148 ; H01L 2/150 ;
Abstract

A semiconductor device is disclosed in which a heat sink is difficult to warp and which is inexpensive. The semiconductor device comprises a heat sink, a pair of screwing pieces having respective inner end portions connected to both ends of the heat sink and further having outer end portions respectively formed with through spaces for screwing, one or more semiconductor chips fixed to a main surface of the heat sink, a seal member formed of an insulating resin which covers a back side of the heat sink and also covers the other portions of the paired screwing pieces than the outer end portions, a first lead having an outer end portion projecting from the seal member and further having an inner end portion which is positioned within the seal member and whose inner end is arranged near one side face of the heat sink, a second lead having an outer end portion projecting from the seal member and further having an inner end portion positioned within the seal member and near another side face of the heat sink, and plural conductive wires for electrically connecting between the leads and predetermined electrodes of a predetermined semiconductor chip, or between the leads and predetermined electrodes of a predetermined semiconductor chip and also between predetermined electrodes of a predetermined semiconductor chip and predetermined electrodes of a predetermined semiconductor chip.


Find Patent Forward Citations

Ito, Mamoru. (2004). Semiconductor device and manufacturing the same (U.S. Patent No. 6703261). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6703261

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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