The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 09, 2004
Filed:
Nov. 02, 2000
Applicant:
Inventors:
Shinichi Nakagawa, Tochigi, JP;
Shuji Sakai, Kanagawa, JP;
Assignee:
E.I. du Pont de Nemours and Company, Wilmington, DE (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B29D 2/300 ;
U.S. Cl.
CPC ...
B29D 2/300 ;
Abstract
A resin molded article for fitting to an inside wall of a liner in a chamber of a dry etching apparatus used in semiconductor manufacture is disclosed. The resin molded article is a seamless annular molded article having a heat resistance temperature of at least 100° C., a tensile elongation at break of at least 0.3%, a flexural modulus of at least 10,000 kg/cm , an outside diameter from 0 to 0.3% larger than the inside diameter of the liner, and a wall thickness of not more than 2 mm.