The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 09, 2004
Filed:
Dec. 11, 2001
Applicant:
Inventors:
Toshihide Ito, Toyama, JP;
Shiro Hara, Aichi, JP;
Assignee:
Other;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23K 3/102 ; C22C 1/300 ;
U.S. Cl.
CPC ...
B23K 3/102 ; C22C 1/300 ;
Abstract
A solder consists essentially of 1.0% to 4.0% of Ag by mass, 0.2% to 1.3% of Cu by mass, 0.02% to 0.06% of Co by mass, and the remaining of Sn and inevitable impurities.
Ito, Toshihide. (2004). Solder, method for processing surface of printed wiring board, and method for mounting electronic part (U.S. Patent No. 6702176). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6702176
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile