The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 02, 2004
Filed:
Mar. 29, 2002
Dai Nakajima, Tokyo, JP;
Hideaki Chuma, Tokyo, JP;
Mitsubishi Denki Kabushiki Kaisha, Tokyo, JP;
Abstract
A semiconductor device which satisfies both the requirements for radiation performance and for miniaturization while having a semiconductor element for a heavy current. The semiconductor device has an IGBT element ( ) and diode element ( ) which are provided on the main surface of the heat spreader ( ) in a strip form formed of a metal with excellent heat conductivity and electricity conductivity. In addition, a relay terminal block ( ) is provided outside of the IGBT element ( ) on the main surface of the heat spreader ( ) and the relay terminal block ( ), the IGBT element ( ) and the diode element ( ) are aligned. Then, the external connection electrode plates ( ) and ( ) are, respectively, provided on both sides of this alignment. The heat spreader ( ), the IGBT element ( ), the diode element ( ), the relay terminal block ( ) and the external connection electrode plate ( ) are sealed in a resin of a box shape by using transfer molding and the resin package ( ) defines the external form of the semiconductor device (M ).