The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 02, 2004

Filed:

Dec. 30, 2002
Applicant:
Inventor:

Richard S. Norman, Sutton, CA;

Assignee:

Hyperchip Inc., Montreal, CA;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 2/710 ; H01L 2/166 ; H01L 2/182 ;
U.S. Cl.
CPC ...
H01L 2/710 ; H01L 2/166 ; H01L 2/182 ;
Abstract

The present invention provides a semiconductor wafer that has a predetermined global functionality and comprises a top surface, a bottom surface and a peripheral edge between the top surface and the bottom surface. An integrated circuit is fabricated on the semiconductor wafer and includes a working set of discrete functional modules arranged into a central rectangular array of rows and columns defined by a boundary that includes four rectilinear sides and four corners. The integrated circuit further includes a spare set of discrete functional modules formed outside the boundary of the working set into at least one line that is disposed along a side of the rectangular array of the working set. If a discrete functional module in the working set is found to be defective, it can be replaced by a discrete functional module in the spare set.


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