The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 02, 2004
Filed:
Feb. 28, 2002
Robert M. Bogursky, Encinitas, CA (US);
Craig M. Kennedy, San Marcos, CA (US);
Kenneth Krone, San Diego, CA (US);
Joseph J. Lynch, San Marcos, CA (US);
Autosplice, Inc., San Diego, CA (US);
Abstract
Upper and lower planar circuit boards are connected in spaced apart parallel relationship by a plurality of contacts each made of a conductive pin, insulative collar and solder ball. The upper ends of the pins are inserted in plated though holes in the upper circuit board and soldered thereto by wave soldering or re-flow. The pins have shoulders to establish the penetration of the pins into the upper circuit board. The lower ends of the pins are bonded to conductive pads on the lower circuit board via the solder balls that are maintained in substantially spherical configuration by the insulative collars and accommodate variations in board co-planarity or pin length. Where the lower ends of the pins do not contact their corresponding conductive pads the volume of solder in the solder balls allows reliable fillet solder joints to be formed.