The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 02, 2004
Filed:
Sep. 24, 2001
Applicant:
Inventor:
Takayuki Asukata, Atsugi, JP;
Assignee:
Nippon Columbia Co., Ltd., Tokyo, JP;
Primary Examiner:
Int. Cl.
CPC ...
G03C 5/00 ;
U.S. Cl.
CPC ...
G03C 5/00 ;
Abstract
It is an object to provide a stamper manufacturing method capable of shortening a time taken for manufacturing a stamper without requiring special equipment such as a dry etching device. The stamper manufacturing method comprises the steps of forming a photoresist layer ( ) on one of surfaces of a conductive substrate ( ), exposing a desirable portion of the photoresist layer ( ), developing the photoresist layer ( ), forming an electroforming body ( ) on the substrate ( ) in a portion from which the photoresist layer ( ) is removed at the developing step, and carrying out washing to remove the photoresist layer ( ) from the substrate ( ).