The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 02, 2004
Filed:
Apr. 16, 2002
Applicant:
Inventors:
Akihisa Wanibe, Nagano-ken, JP;
Noriaki Okazawa, Nagano-ken, JP;
Yoshinao Miyata, Nagano-ken, JP;
Toshinao Shinbo, Nagano-ken, JP;
Tetsuya Akasu, Nagano-ken, JP;
Hisashi Akachi, Nagano-ken, JP;
Assignee:
Seiko Epson Corporation, Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B65D 6/528 ;
U.S. Cl.
CPC ...
B65D 6/528 ;
Abstract
In order to provide a silicon wafer break pattern that stabilizes the location and shape of the breaks at weak spots of the break pattern and that reduces waste, the through-holes of the break pattern is disposed along a scribe line, a first group of the through-holes are substantially disposed on only a first side of the scribe line, and a second group of the through-holes are substantially disposed on only a second side of the scribe line.