The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 02, 2004
Filed:
Sep. 07, 2001
Fumio Uchikoba, Chuo-ku, JP;
TDK Corporation, Tokyo, JP;
Abstract
A method for manufacturing radio frequency module components with a surface acoustic wave element includes a gold plating step of plating gold at a component bonded portion on a conductive surface of a ceramic multi-layer substrate to have a mounted electrode a surface acoustic wave element mounting step of face down bonding a flip chip as the surface acoustic wave element on the ceramic multi-layer substrate by the gold—gold connection, a side wall formation step of bonding a side wall member surrounding the flip chip onto the ceramic multi-layer substrate by adhesives, a lid formation step of bonding a lid member enclosing an opening of the side wall onto the side wall member by adhesives, after mounting the flip chip and a soldered component mounting step of mounting a soldered component by the use of solder, after the lid formation step.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile