The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 24, 2004
Filed:
May. 25, 2001
Toshio Kimura, Chiyoda-ku, JP;
Takashi Shigematsu, Chiyoda-ku, JP;
Shinichiro Iizuka, Chiyoda-ku, JP;
Takeshi Aikiyo, Chiyoda-ku, JP;
The Furukawa Electric Co., Ltd., Tokyo, JP;
Abstract
A bottom plate ( ) of a box-shaped package ( ) is made of a metal. Portions of the package ( ) (peripheral wall ( ) and cover plate ( )) other than the bottom plate ( ) are made of a resin or a ceramic that is more economical than the metal. The material cost of the package ( ) can thus be reduced in comparison with the case where the package ( ) is made of the metal as a whole. A Peltier module ( ) is fixed to the bottom plate ( ). A base ( ) is fixed over the Peltier module ( ), and a semiconductor laser chip ( ) is disposed on this base ( ). Heat from the semiconductor laser chip ( ) and from the Peltier module ( ) can be efficiently radiated through the bottom plate ( ) made of the metal, and deterioration of heat radiation performance can be prevented.