The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 24, 2004
Filed:
Apr. 29, 2002
Juan G. Milla, Mesa, AZ (US);
Medtronic, Inc., Minneapolis, MN (US);
Abstract
Methods are provided for forming a die package. The method comprises stiffening a flexible substrate to provide a first flexibility of the flexible substrate, forming a mounting element on a first side of the flexible substrate, and mounting a first die on the first side of the flexible substrate to couple the first die to the mounting element. Further, the method comprises mounting a second die on a second side of the flexible substrate and mounting a third die on the second side of the flexible substrate to couple the second and third die to the mounting element, respectively. Furthermore, the method comprises adjusting the stiffening to provide a second flexibility of the flexible substrate that is greater than the first flexibility, and stacking the second die and the third die to provide an overlap of a portion of the second die and a portion of the third die.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile