The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 24, 2004

Filed:

Jun. 28, 2002
Applicant:
Inventors:

Jae Hoon Choi, Gyeonggi-Do, KR;

Bong Choi, Suwon, KR;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B24B 1/00 ;
U.S. Cl.
CPC ...
B24B 1/00 ;
Abstract

The operation of a polishing pad conditioner for a CMP apparatus is monitored. The polishing pad conditioner includes a housing, a first drive pulley disposed in the housing and connected to a motor at a first side of the housing, a conditioning head having a diamond disk for conditioning the polishing pad and mounted to a second side of the housing, a second pulley coupled to the conditioning head for transferring the driving force from the drive pulley to the conditioning head, a timing belt engaged with the first and second pulleys, an air supply tube for supplying air under pressure to the conditoner head to force the head against a polishing pad of the CMP apparatus, and at least one sensor disposed in the housing for sensing the operation of the conditioning head.


Find Patent Forward Citations

Choi, Jae. (2004). Polishing pad conditioner for semiconductor polishing apparatus and method of monitoring the same (U.S. Patent No. 6695680). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6695680

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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