The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 24, 2004

Filed:

Jul. 16, 2001
Applicant:
Inventors:

Kenji Chikuan, Kariya, JP;

Michitake Kuroda, Ama-gun, JP;

Assignee:

Denso Corporation, Kariya, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G01L 7/08 ;
U.S. Cl.
CPC ...
G01L 7/08 ;
Abstract

A semiconductor sensor chip is interposed between a sensor case and a housing. A first pressure is introduced from the sensor case and applied to a rear surface of the sensor chip, while a second pressure is introduced from the housing and applied to a front surface of the sensor chip. The sensor chip detects a pressure difference between the first and the second pressures and converts it into an electrical signal. The sensor chip is hermetically mounted in a depressed portion formed in the sensor case by charging a sealing material from holes formed around the depressed portion. The charging holes are positioned between terminals electrically connecting the sensor chip to an outside circuit to avoid enlarging the pressure sensor size by forming the charging holes.


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