The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 24, 2004

Filed:

Apr. 24, 2001
Applicant:
Inventor:

Hideyuki Matsushima, Toyama-ken, JP;

Assignee:

YKK Corporation, Tokyo, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
A44B 1/34 ;
U.S. Cl.
CPC ...
A44B 1/34 ;
Abstract

This invention intends to provide a snap with supports, the snap being formed of resin across a pair of tapes in a simple manner thereby leading to improvement of productivity and securing a solid structure and practical performance. Supports such as tapes are disposed in parallel with a gap. By using this gap, male bodies or female bodies of the snaps of thermoplastic resin are formed across opposing edges of the tapes opposing each other at a predetermined pitch by injection molding means or extrusion molding means. A string may be used as the support. Different from a conventional processing in which an attaching hole is made in the center of the tape and resin snap is formed therein, a boring step is not necessary. Thus, this snap with tapes is created through such a simple processing.


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