The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 17, 2004

Filed:

Apr. 02, 2002
Applicant:
Inventors:

Akio Wada, Hyogo, JP;

Kaneyoshi Shimizu, Osaka, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06F 1/900 ;
U.S. Cl.
CPC ...
G06F 1/900 ;
Abstract

Method for manufacturing a wiring harness or a substrate for wiring wherein the wiring diagram applied to the substrate is based on the wiring harness information. Entities representing connectors, binding parts, and wiring length information of wirings are input. The wiring arrangement diagram includes lines that correspond to the wirings and do not have a length corresponding to actual length of the wirings. The wiring harness is made using the information including total length of wiring between each of the connectors, harness information generated based on the entities, and the length information of the desired wiring arrangement. Alternatively, the wiring harness information is used to draw a wiring diagram for fixing on the substrate.


Find Patent Forward Citations

Wada, Akio. (2004). Method for manufacturing a substrate-for-wiring/ wiring harness (U.S. Patent No. 6694203). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6694203

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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