The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 17, 2004

Filed:

Feb. 09, 2000
Applicant:
Inventors:

Stephen J. Whitney, Lake Zurich, IL (US);

Louis Rector, Allegany, NY (US);

Hugh M. Hyatt, Bremerton, WA (US);

Anthony D. Minervini, Orland Park, IL (US);

Honorio S. Luciano, Elk Grove Village, IL (US);

Assignee:

Littelfuse, Inc., Des Plaines, IL (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 7/13 ;
U.S. Cl.
CPC ...
H01L 7/13 ;
Abstract

An arrangement of voltage variable materials for the protection of electrical components from electrical overstress (EOS) transients. A device having a plurality of electrical leads, a ground plane and a layer of voltage variable material. The voltage variable material physically bonds the plurality of electrical leads to one another as well as provides an electrical connection between the plurality of electrical leads and the ground plane. A die having a circuit integrated therein is attached to the ground plane. Conductive members electrically connect the plurality of electrical leads to the integrated circuit. At normal operating voltages, the voltage variable material has a high resistance, thus channeling current from the electrical leads to the integrated circuit via the conductive members. In response to a high voltage EOS transient, the voltage variable material essentially instantaneously switches to a low resistance state, channeling the potentially harmful EOS transient to the ground plane and away from the integrated circuit.


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