The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 17, 2004

Filed:

Mar. 19, 2001
Applicant:
Inventors:

David Emil Nelson, Waterford, MI (US);

Bob X. Li, Grand Blanc, MI (US);

Mark David Hemingway, Columbiaville, MI (US);

Suresh Baskaran, Kennewick, WA (US);

Joachim Kupe, Davisburg, MI (US);

Gregory Stephen Sims, Detroit, MI (US);

Delbert L. Lessor, Richland, WA (US);

Carl Elmer Miller, Millington, MI (US);

Darrell R. Herling, Kennewick, WA (US);

Assignee:

Delphi Technologies, Inc., Troy, MI (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B01J 1/908 ;
U.S. Cl.
CPC ...
B01J 1/908 ;
Abstract

A non-thermal plasma (NTP) reactor structural conductor element includes a base conductor support and a high dielectric constant (“high k”) barrier layer supported by and substantially surrounding the base conductor support to form a structural conductor NTP reactor element. The structural conductor element may comprise a variety of shapes such as plates, sheets, half-box, I shapes, C shapes, or comb shapes, among others. In one embodiment, the dielectric barrier layer includes a coating applied to the base conductor support. In another embodiment, the dielectric barrier layer includes a high k film laminated to the base conductor support. In yet another embodiment, the base conductor support integrally forms the dielectric barrier layer via conversion of surfaces of the base conductor using electrochemical, thermal or chemical means to form the dielectric barrier layer.


Find Patent Forward Citations

Loading…