The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 17, 2004
Filed:
Nov. 02, 2001
Seiichi Kobayashi, Tamagawa-Mura, JP;
Tadayoshi Nagasawa, Tamagawa-Mura, JP;
Yutaka Noguchi, Tamagawa-Mura, JP;
Hiroyasu Mori, Tamagawa-Mura, JP;
Mitsuo Sakakura, Tamagawa-Mura, JP;
Toko Kabushiki Kaisha, Tokyo-to, JP;
Abstract
A method for manufacturing a laminated electronic component, in which magnetic layers and conductive patterns for coil are sequentially provided, a coil pattern is enclosed between the magnetic layers inside a laminated body, and a nonmagnetic section is provided between adjacent conductive patterns for coil, the coil pattern being provided by repeatedly performing: a first step of providing a second magnetic layer over the entire top face of a first magnetic layer, which a first conductive pattern for coil is provided on; a second step of providing a loop-shaped groove in the second magnetic layer by using laser processing; a third step of providing a nonmagnetic section in one portion of the loop-shaped groove; and a fourth step of printing a second conductive pattern for coil so that one end section thereof overlaps the end section of the first conductive pattern for coil and the other end section extends to the surface of the nonmagnetic section.