The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 17, 2004
Filed:
Dec. 06, 2001
Joseph A. Schmukler, Glenwood, MD (US);
Dean Michael Cymek, Havre de Grace, MD (US);
Iqbal Dar, Marriottsville, MD (US);
Ciena Corporation, Linthicum, MD (US);
Abstract
A module for holding a printed circuit board (PCB) includes rectangular-shaped, mating top and bottom brackets. Three walls of the top bracket retain SMA connectors that interconnect with the PCB. A dielectric gasket is provided below each SMA connector to provide pressure on the leads thereof so that the leads adequately contact corresponding pads on the PCB. Two walls of the bottom bracket include channels that slidably receive and retain the PCB therein, and another wall includes a stop channel that retains an edge portion of the PCB when the PCB is slid through the channels. The bottom bracket also has diamond-shaped pads and a square-shaped pad connected between two walls thereof that align with and support corresponding components provided on the PCB and dissipate heat generated thereby. A cable connector provided on one end of an electrical cable connects to each SMA connector, and the other ends of the electrical cables connect to testing equipment. Thus, when the top bracket is connected to the bottom bracket, the dielectric gaskets provide pressure on SMA connector leads so that the leads adequately contact corresponding pads on the PCB and enable the PCB to be tested without being permanently affixed to the module. The module may be attached to a heatsink that, in conjunction with the diamond-shaped pads and the square-shaped pad, permits heat to be dissipated from the PCB at the same rate that heat is dissipated from an installed PCB.