High speed electronic parts mounting apparatus having mounting heads which alternately mount components on a printed circuit board

Abstract

A compact and high-speed automatic electronic parts mounting apparatus is provided which includes first and second parts feeders, first and second mounting heads, a printed board-holding table, and a controller. Each of the first and second parts feeders includes a plurality of cassettes storing therein electronic parts and having pick-up stations. The second parts feeder is arranged at a preselected interval away from the first parts feeder in a first direction. Each of the first and second mounting heads is movable in the first direction and includes a plurality of pick-up nozzles movable in a vertical direction for picking up the electronic parts from the pick-up stations of the cassettes. The printed board-holding table is disposed within the preselected interval between the first and second parts feeders so as to move in a second direction perpendicular to the first direction. The controller controls the movement of the table and the first and second mounting heads so that the first and second mounting heads pick up the electronic parts from the cassettes of the first and second parts feeders, respectively, and mount them on a printed board held on the table in sequential mounting operations.