The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 10, 2004

Filed:

Apr. 08, 2002
Applicant:
Inventor:

Peter Lahnor, Dresden, DE;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 2/1302 ; H01L 2/1461 ; C23F 1/02 ; B24B 4/702 ;
U.S. Cl.
CPC ...
H01L 2/1302 ; H01L 2/1461 ; C23F 1/02 ; B24B 4/702 ;
Abstract

The method allows simultaneous polishing of a plurality of objects of a similar type, preferably silicon wafers. The polishing process is interrupted briefly at least once. During the polishing pause, the carriers on which the objects to be polished have been mounted are rotated onward sequentially and then the polishing operation is continued. The objects are mounted on one or more carriers which are at a free position during the polishing operation. This has the advantage that the polishing operation does not have to be additionally interrupted for the purpose of loading and unloading the carrier. This saves valuable machine time, so that the throughput is increased. At the same time, the fact that each wafer is processed at a plurality of polishing plates stabilizes the result of polishing, since the individual abrasion properties of the individual polishing plates are averaged out.


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