The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 10, 2004

Filed:

Jan. 07, 2002
Applicant:
Inventors:

Koji Seki, Tokyo, JP;

Nobuyuki Sugiyama, Tokyo, JP;

Shingo Ogawa, Tokyo, JP;

Naoki Oguro, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B29C 4/564 ;
U.S. Cl.
CPC ...
B29C 4/564 ;
Abstract

An injection molding apparatus includes a vessel, mold, pusher, and thrust providing section. The vessel stores a molding material and has a nozzle hole which is formed in the bottom portion to inject the molding material and a first seal surface formed around the nozzle hole. The mold is made up of stacked members stacked on the lower side of the vessel and is filled with the molding material injected from the vessel. The mold has a sprue communicating with the nozzle hole and a second seal surface formed around the sprue. The stacked members respectively have third seal surfaces at portions where the members are in contact with each other. The pusher pressurizes the molding material in the vessel. The thrust providing section provides a thrust to the pusher to pressurize one of the pusher and the mold through the molding material in the vessel. The thrust providing section brings the first, second, and third seal surfaces into tight contact with each other by providing a downward thrust to the pusher with respect to the mold. An injection molding method is also disclosed.


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