The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 03, 2004
Filed:
Apr. 14, 2003
Applicant:
Inventor:
Yasufumi Uchida, Tokyo, JP;
Assignee:
Oki Electric Industry Co, Ltd., Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 2/144 ;
U.S. Cl.
CPC ...
H01L 2/144 ;
Abstract
A semiconductor device includes a substrate ( ); a first semiconductor chip ( ) mounted on the substrate; and a first insulating layer ( ) which is provided on the first semiconductor chip. The device further includes a metal layer ( ) which is provided on the first insulating layer; a second insulating layer ( ) which is provided on the metal layer; and a second semiconductor chip ( ) which is provided on the second insulating layer.
Uchida, Yasufumi. (2004). Method for fabricating multi-chip package semiconductor device (U.S. Patent No. 6686223). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6686223
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile