The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 03, 2004

Filed:

Aug. 17, 2001
Applicant:
Inventors:

Kenneth Meade Lakin, Redmond, OR (US);

Ralph Edward Rose, Bend, OR (US);

Assignee:

TFR Technologies, Inc., Bend, OR (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G03C 5/56 ;
U.S. Cl.
CPC ...
G03C 5/56 ;
Abstract

A method for fabricating patterned layers of a desired material in a desired, design pattern upon a substrate, which method may be used in circumstances where the removal of photo-resist material may not be used to lift-off undesired portions of the material from the substrate. The method uses copper or some other conducting material instead of the photo-resist material, Which copper or other conducting material may be removed by chemical processes to lift-off the undesired portions of material deposited upon the conducting material and substrate. The copper or other conducting material is fabricated upon the substrate so as to have a lip that overhangs and shadows the boundary of photo-resist material previously fabricated upon the substrate in the desired pattern. The photo-resist material is removed from the substrate and the desired material is deposited upon the substrate in a substantially directed manner such that the lip of conducting material prevents the deposition of a substantial amount of the desired material upon the edge of the copper or other conducting material. As a consequence, chemical means can then be used to remove the conducting material, thus undercutting and lifting-off that portion of the desired material deposited upon the substrate which is not included within the design pattern.


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