The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 6685815 B1

PDF
Full Text
Expired
Date of Patent:
Feb. 03, 2004

Filed:

Jan. 14, 2002
Applicant:
Inventor:

Nicolay Kovarsky, Sunnyvale, CA (US);

Assignee:

Applied Materials Inc., Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C25D 2/106 ; C25D 2/116 ;
U.S. Cl.
CPC ...
C25D 2/106 ; C25D 2/116 ;
Abstract

An electro-chemical deposition apparatus and method are generally provided. In one embodiment of the invention, an electro-chemical deposition apparatus includes a housing having a substrate support disposed therein and adapted to rotate a substrate. One or more electrical contact elements are disposed on the substrate support. A drive system is disposed proximate the housing. The drive system is magnetically coupled to and adapted to rotate the substrate support. In another embodiment, a method of plating a substrate includes the steps of covering a substrate supported within a housing with electrolyte, and displacing a portion of the electrolyte from the housing prior to electrically biasing the substrate, and electrically biasing the substrate.


Find Patent Forward Citations

Kovarsky, Nicolay. (2004). Electroplating of semiconductor wafers (U.S. Patent No. 6685815). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6685815

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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