The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 6685304 B1

PDF
Full Text
Expired
Date of Patent:
Feb. 03, 2004

Filed:

Nov. 07, 2001
Applicant:
Inventor:

Takaaki Miyamoto, Kanagawa, JP;

Assignee:

Sony Corporation, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B41J 2/05 ; H05B 3/00 ;
U.S. Cl.
CPC ...
B41J 2/05 ; H05B 3/00 ;
Abstract

A printer, a printer head, and a method of producing the printer head in which ink drops are caused to flow out by heat, so that an orifice plate can be bonded by sufficiently bringing it into close contact with that to which it is to be bonded. The printer head is formed by successively placing predetermined materials upon each other on a semiconductor substrate of a semiconductor device, and at least one of the lamination materials placed upon each other on the semiconductor substrate is smooth so that a surface where a plate-shaped material forming a nozzle is disposed is smooth.


Find Patent Forward Citations

Miyamoto, Takaaki. (2004). Printer, printer head and method of producing the print head to promote reliable bonding of print head structures (U.S. Patent No. 6685304). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6685304

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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