The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 27, 2004
Filed:
May. 15, 2001
Wadood Hamad, Mahwah, NJ (US);
Robert A. Hulbert, Highland, NY (US);
Henry J. Kent, Bloomingburg, NY (US);
International Paper Company, Stamford, CT (US);
Abstract
A method and an apparatus for predicting a score-line cracking propensity of a multi-ply substrate. The method includes the steps of: bending the multi-ply substrate; acquiring tensile load data from the multi-ply substrate during bending; and computing a material property of a top ply of the multi-ply substrate based on the acquired tensile load data. The material property must show a strong correlation to the score-line cracking propensity of the multi-ply substrate. The material property which is computed is the energy consumed in plastic deformation of the top ply during the fracture process. The measurement results can be used to predict score-line cracking propensity in multi-ply board systems, such as multi-ply paperboard.