The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 27, 2004
Filed:
Aug. 29, 2001
Brenor L. Brophy, San Jose, CA (US);
James H. Lie, San Jose, CA (US);
Andrew J. Wright, Mountain View, CA (US);
Cypress Semiconductor Corporation, San Jose, CA (US);
Abstract
A ball grid array (BGA) package is disclosed. An interconnect structure is formed on a substrate that electrically connects the electrical device to be housed in the BGA package to the solder balls thereon. Contact pads are formed over the top surface of the substrate. These contact pads electrically connect to the interconnect structure. A layer of solder mask is formed over the substrate that includes openings that overlie the contact pads. The BGA is then completed using conventional process steps. Thereby, a BGA package is formed that includes contact pads disposed such that the contact pads are accessible from the top of the BGA package, making these contact pads easily accessible. Thus, when the BGA is attached to a circuit board, connection to circuits of the electrical device is obtainable.