The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 27, 2004
Filed:
Jan. 11, 2002
Applicant:
Inventors:
Hiroshi Haji, Chikushino, JP;
Shoji Sakemi, Ogoori, JP;
Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 2/348 ; H01L 2/352 ; H01L 2/940 ;
U.S. Cl.
CPC ...
H01L 2/348 ; H01L 2/352 ; H01L 2/940 ;
Abstract
A semiconductor device including a semiconductor substrate having a thickness of not more than 300 &mgr;m and a resin layer formed on a face thereof. A plurality of conductor sections formed in and through the resin layer, and a plurality of electrodes located on the resin layer and connected by the conductor sections to electrodes of semiconductor elements located on the substrate. The resin layer includes at least one of silica, alumina, zirconia, quartz fiber, glass fiber resin fiber and inorganic particles capable of absorbing ionic impurities.