The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 27, 2004
Filed:
May. 10, 2002
Olivier Vendier, Lacroix-Falgarde, FR;
Norbert Venet, La Salvetat St Gilles, FR;
Philippe Calvel, Muret, FR;
Stéphane Albinet, Plaisance Du Touch, FR;
Jean-Cyril Esther, Vigoulet Auzil, FR;
Marc Huan, Cox, FR;
Alcatel, Paris, FR;
Abstract
A method of obtaining a module ( ), and the module obtained, from modular electronic components encapsulated in flat monoblock packages ( A) in which elements constituting the components are buried and from which project laterally conductive connecting leads ( A), the packages being stacked and buried in an insulative block corresponding to at least one module and the projecting connecting leads of the stacked packages being flush with a surface of the block, on at least one face of said block on which are formed conductive interconnection tracks and/or contacts for connecting the leads with connecting means external to the module. The method includes, before stacking the packages, an operation of modifying the connecting leads of the packages in order to reduce their overall size and an operation of reducing the height of the packages by thinning their respective bases.