The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 27, 2004

Filed:

Mar. 15, 2000
Applicant:
Inventors:

Thierry Renault, Vernon, FR;

Francis Vendangeot, Chateaubriant, FR;

Jacques Heinry, Pouance, FR;

Assignee:

Patent Holding Company, Fraser, MI (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29C 5/108 ;
U.S. Cl.
CPC ...
B29C 5/108 ;
Abstract

A method and system for molding thermoplastic sandwich material to form a deep-drawn article utilizing a unique clamping technique and mechanism are described. The method includes the steps of positioning a blank of thermoplastic sandwich material having a cellular core over a female die having an article-defining cavity defined by inner surfaces of the female die. Then, an inner portion of the blank is forced into the female die along a substantially vertical axis and against the inner surfaces of the female die to obtain deep-drawn material. During the step of forcing at least one outer portion of the blank immediately adjacent the female die is clamped to guide the at least one outer portion of the blank to travel into the article-defining cavity at an acute angle with respect to the vertical axis. Thickness of at least one side wall of the deep-drawn material is substantially the same as thickness of the blank of thermoplastic sandwich material. The deep-drawn material does not significantly stretch or tear during the step of forcing due to the clamping technique and mechanism.


Find Patent Forward Citations

Loading…