The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 27, 2004

Filed:

Feb. 02, 2000
Applicant:
Inventors:

David Lischner, Allentown, PA (US);

Raymond J. Nika, Whitehall, PA (US);

James Robert Ronemus, Lehighton, PA (US);

Assignee:

Agere Systems, Inc., Allentown, PA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 3/34 ;
U.S. Cl.
CPC ...
H05K 3/34 ;
Abstract

A method of connecting a heatspreader to an integrated circuit device that is connected to a substrate in a flip-chip configuration includes forming a heatspreader from a single flat sheet of metal. The heatspreader has a heatspreader plate and a plurality of legs. The legs are flat plate portions substantially parallel to the heatspreader plate. A first thermal interface material is used to connect the heatspreader plate to a non-active side of the integrated circuit device. A second thermal interface material is used to connect each of the plurality of legs to the substrate.


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Lischner, David. (2004). Heatspreader for a flip chip device, and method for connecting the heatspreader (U.S. Patent No. 6681482). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6681482

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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